技术参数

• Part Status Active
• Architecture MPU, FPGA
• Core Processor RISC-V
• Flash Size 128KB
• RAM Size 1.8MB
• Peripherals DMA, PCI, PWM
• Connectivity CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed -
• Primary Attributes FPGA - 23K Logic Modules
• Operating Temperature -40°C ~ 125°C (TJ)
• Grade Automotive
• Qualification AEC-Q100
• Package / Case 325-TFBGA
• Supplier Device Package 325-BGA (11x11)
• Number of I/O 182
• RoHS Status ROHS3 Compliant
• HTSUS 8542.31.0070