技术参数

• Part Status Active
• Architecture MPU, FPGA
• Core Processor RISC-V
• Flash Size -
• RAM Size -
• Peripherals DMA, PCI, PWM
• Connectivity CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed -
• Primary Attributes FPGA - 254K Logic Modules
• Operating Temperature -40°C ~ 100°C (TJ)
• Grade -
• Qualification -
• Package / Case 484-BFBGA
• Supplier Device Package 484-FBGA (19x19)
• Number of I/O 280
• RoHS Status ROHS3 Compliant
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• ECCN 3A991A2
• HTSUS 8542.31.0060