技术参数

• Part Status Active
• Architecture MCU, FPGA
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size -
• RAM Size 64KB
• Peripherals DMA, POR, WDT
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed 700MHz
• Primary Attributes FPGA - 110K Logic Elements
• Operating Temperature -40°C ~ 125°C (TJ)
• Grade Automotive
• Qualification AEC-Q100
• Package / Case 896-BGA
• Supplier Device Package 896-FBGA (31x31)
• Number of I/O MCU - 181, FPGA - 288
• RoHS Status RoHS Compliant
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• ECCN 3A991D
• HTSUS 8542.31.0070