技术参数

• Part Status Not For New Designs
• Kit Type Adapter, Breakout Boards
• Quantity 18 Pieces (3 Values - 6 Each)
• Package Accepted HTSSOP, VFBGA, XFBGA
• Specifications SMD to DIP
• Number of Positions 24
• RoHS Status ROHS3 Compliant
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• ECCN EAR99
• HTSUS 8534.00.0070