技术参数

• Part Status Not For New Designs
• Kit Type Adapter, Breakout Boards
• Quantity 23 Pieces (4 Values - Mixed Quantities)
• Package Accepted QSOP, TSSOP28, XFBGA, XQFN
• Specifications SMD to DIP
• Number of Positions 16, 28
• RoHS Status ROHS3 Compliant
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• ECCN EAR99
• HTSUS 8534.00.0040