技术参数

• Part Status Active
• Architecture MCU, FPGA
• Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size -
• RAM Size 256KB
• Peripherals DMA, WDT
• Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed 1.5GHz
• Primary Attributes FPGA - 1100K Logic Elements
• Operating Temperature 0°C ~ 100°C (TJ)
• Package / Case 1760-BBGA, FCBGA
• Supplier Device Package 1760-FBGA (42.5x42.5)
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• HTSUS 8542.31.0070