技术参数

• Part Status Active
• Architecture DSP, MCU, MPU
• Core Processor ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
• Flash Size -
• RAM Size 868KB
• Peripherals DMA, PWM, WDT
• Connectivity CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
• Speed 1.8GHz, 800MHz
• Primary Attributes -
• Operating Temperature 0°C ~ 95°C (TJ)
• Package / Case 548-LFBGA
• Supplier Device Package 548-LFBGA (15x15)
• Number of I/O -
• RoHS Status ROHS3 Compliant
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• ECCN 5A992C
• HTSUS 8542.31.0070